Wavenology series software products are designed for simulating ubiquitous wave behaviors which are widely applied in both industry production processes and academic research, such as electromagnetic waves in electronic packaging and optical systems, acoustic waves in biomedical imaging, and elastic waves in geophysical subsurface sensing.
The core technique used in Wavenology is the hybrid transient solver framework, in which the major time domain numerical simulation algorithms, such as Finite Difference (FD), Finite Element (FE) and Spectral Element (SE) methods are hybridized in a single solution scheme. And according to the problem complexity as well as the efficiency requirement, different methods will be chosen accordingly to solve the problem in its optimal accuracy/cost ratio. For multi-scale problems, different solvers can also be applied to different aspects of the problem and can simulate the task altogether.
The Wavenology series continues to grow and improve by accumulating and preparing the leading-edge simulation techniques for the future generation simulator.
There are four blocks in the Wavenology package: GUI, database, 3D geometry modeler and engine. Each block is assigned to a particular responsibility and functionalities.
The logic view of the overall structure is shown in Fig. 1. This structure contains three logic layers, View (including GUI), Data Management (including Database), and Data Processing (including 3D Geometry Modeling and Engine).
Fig. 1. The overall structure of Wavenology package
Radio Frequency (RF) and Microwave Applications
- Wire, aperture, spiral, horn, and microstrip antennas
- Phased antenna arrays, antenna feeds
- Antenna interactions with tissues for biomedical applications
- Smart antennas (co-design of antennas and circuits)
- Transmitters and receivers for RFID applications
- Circulators, connectors, couplers, filters, and isolators
- Waveguides, microwave hyperthermia, RF radiation, MRI coils
- Scatterings, time-reversal imaging, metamaterials
Electronics Signal and Power Integrity
- Resistors, Capacitors, Inductors, Interconnects
- Power planes and ground planes
- Transformers, transitions, transmission lines, vias
- Cross talks, packaging effects
- Couplers, dielectric waveguides, gratings
- Optical fibers and resonators
- Photonic crystals, surface plasmons
- Seismic exploration.
- Ultrasound imaging.